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freescale semiconductor document number: mma955xl data sheet: advance information rev. 1, 10/2011 an energy efficient solution by freescale this document contains information on a new product. specifications and information herein are subject to c hange without notice. ? 2011 freescale semiconductor, inc. all righ ts reserved. intelligent motion-sensing platform the mma955xl device is a member of freesca le?s xtrinsic family of intelligent sensor platforms. this device incorporates dedicated accelerometer mems transducers, signal conditioning, data co nversion, and a 32-bit programmable microcontroller. this unique blend transforms freescale?s mma955xl into an intelligent, high- precision, motion-sensing platform able to manage multiple sensor inputs. this device can make system-level decisions required for sophisticated applications such as gesture recognition, pedometer functionality, tilt compensation and calibration, and activity monitoring. the mma955xl device is programmed and configured with the codewarrior development studio for microcontrollers software, version 10.1 or later. this standard integrated design environment enables customers to quickly implement custom algorithms and featur es to exactly match their application needs. using the master i 2 c port, the mma955xl device can manage secondary sensors, such as pressure sensors, magnetometers, or gyroscopes. this allows sensor initialization, calibratio n, data compensation, and computation functions to be off-loaded from t he system application processor. the mma955xl device also acts as an intelligent sensing hub and a highly configurable decision engine. total system power consumption is significantly reduced because the application processor stays powered down until absolutely needed. hardware features ? three accelerometer operating ranges: ? 2g suits most hand gestures (orientation detection and tit control) and freefall. for tap detection, 4g and 8g are supported. ? 4g covers most regular human dynamics (walking and jogging) ? 8g detects most abrupt activities (gaming) ? integrated temperature sensor ? one slave spi or i 2 c interface operating at up to 2 mbps, dedicated to communication with host processor . default value of the i 2 c, 7-bit address is 0x4c. (this can be customized by firmware.) ? one master i 2 c interface operating at up to 400 kbps that can be used to communicate with external sensors ? eight selectable output data rates (odr), from 488 hz to 3.8 hz ? 10, 12, 14, and 16-bit trimm ed adc data formats available ? 1.8v supply voltage ? 32-bit coldfire v1 cpu with mac unit ? extensive set of power-management features and low-power modes ? integrated adc can be used to convert external analog signals ? single-wire, background-debug mode (bdm) pin interface ? 16-kb flash memory ? 2-kb random access memory ? rom-based flash controller and sl ave-port, command-line interpreter ? two-channel timer with in put capture, out put capture, or edge-aligned pwm ? programmable delay block for scheduling events relative to start of frame ? a 16-bit, modulo timer for scheduling periodic events ? minimal external component requirements ? rohs compliant (-40 to +85oc), 16-pin, 3 x 3 x 1-mm lga package 16-pin lga 3 mm x 3 mm x 1 mm case 2094-01 mma955xl top and bottom view top view pin connections 1 2 3 4 5 678 9 13 12 11 10 16 15 14 v dd rgpio7/an1/ tpmch1 rgpio8/pdb_b sda0/rgpio1/sdi bkgd-ms /rgpio9 resetb scl0/rgpio0 sclk v ss rgpio2/scl1/sdo rgpio3/sda1/ssb rgpio6/an0 tpmch0 rgpio5/pdb_a/ int_o v ss rgpio4/int v dda v ssa
mma955xl sensors 2 freescale semiconductor, inc. software features this device can be programmed to provide any of the following: ? orientation detection (portrait/landscape) ? high-g/low-g threshold detection ? pulse detection (single, double and directional tap) ? tilt detection ? auto wake/sleep ? embedded, smart fifo ? power management ? pedometer a selection of the software features are included in the fact ory-programmed firmware for some devices. users may add their own features with user firmware.the power and flexibility of t he embedded coldfire v1 mcu core has new and unprecedented capabilities. table 1. ordering information part number firmware temperature range package description shipping mma9550lt motion -40c to +85c lga-16 tray mma9550lr1 motion -40c to +85c lga-16 tape and reel mma9551lt gesture -40c to +85c lga-16 tray mma9551lr1 gesture -40c to +85c lga-16 tape and reel MMA9553LR1 pedometer -40c to +85c lga-16 tape and reel mma 9559lr1 foundation -40c to +85c lga-16 tape and reel
mma955xl sensors 3 freescale semiconductor, inc. related documentation the mma955xl device features and operations are described in a variety of reference manuals, user guides, and application notes. to find the most-current versions of these documents: 1. go to the freescale homepage at: http://www.freescale.com/ 2. in the keyword search box at the top of the page, enter the device number mma955xl. 3. in the refine your result pane on the left, click on the documentation link. contents 1 variations of mma955xl device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 typical applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 general description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1. . functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2. . packaging information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2.1 package diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2.2 sensing direction and output response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.2.3 pin functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.3. . pin function descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4. . system connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4.1 power sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4.2 layout recommendations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4.3 mma955xl platform as an intelligent sl ave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.4.4 mma955xl platform as a sensor hub . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4 mechanical and electrical specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.1. . definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.2. . pin groups . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.3. . absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.4. . operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.5. . electrostatic discharge (esd) and latch-up protection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.6. . general dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.7. . supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.8. . accelerometer transducer mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.9. . temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.10. adc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.11. adc sample rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.12. ac electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.13. general timing control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.14. i 2 c timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.14.1 slave i 2 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.14.2 master i 2 c timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.15. slave spi timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4.16. flash parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
mma955xl sensors 4 freescale semiconductor, inc. 1 variations of mma955xl device freescale offers a variety of firmware versions for the mma955xl devices. the different versions of the device are identified b y the fourth digit in the part number (for example mma955 9 ). information and specifications prov ided in this data sheet are inde- pendent of the freescale firmware versions. the following table lists some of the variations among the mma955xl-platform devices. table 2. features of product-line devices feature - device mma9550l mma9551l mma9553 mma9559l key elements motion sensing gesture sensing pedometer high flexibility user flash available 6.5 kb 4.5 kb 1.5k 14 kb user ram available 576 bytes 452 bytes 200 bytes 1664 bytes digital resolution (bits) 10,12,14,16 bits 10 ,12,14,16 bits 10,12,14,16 bits 10,12,14,16 bits g measurement ranges 2g, 4g, 8g 2g, 4g, 8g 2g, 4g, 8g 2g, 4g, 8g real-time and preemptive scheduling yes yes yes no event management no no no yes slave port command interpreter ? normal mode ye s ye s ye s n o ? legacy mode ye s ye s ye s n o ? streaming mode ye s ye s ye s n o front-end processing ? 100-hz bw anti-aliasing ye s ye s ye s n o ? 50-hz bw anti-aliasing ye s ye s ye s n o ? g-mode-dependent resolution ye s ye s ye s ye s ? absolute value ye s ye s ye s n o ? low-pass filter ye s ye s ye s n o ? high-pass filter ye s ye s ye s n o ? data-ready interrupt ye s ye s ye s ye s gesture applications ? high g/low g no yes no no ? tilt no yes no no ? portrait/landscape no yes no no ? programmable orientation no yes no no ? tap/double-tap no yes no no ? freefall no yes no no ?motion no yes no no
mma955xl sensors freescale semiconductor, inc. 5 the only difference between the various device c onfigurations is the firmwar e content that is loaded in to the flash memory at t he factory. the user still can add custom software using the remaining portion of flash memory. the mma9550, mma95501, and mma95503 devices can function immedi ately as they are. they have an internal command interpreter and applications scheduler and can interact directly with the users? host system. the mma9559 device provides the most flexibility and is for us ers who need to design their own control loop and system. the device needs to be programmed with custom user code. data-storage modules ?data fifo ye s ye s ye s n o ? event queue ye s ye s ye s n o ? inter-process fifo no no no yes power-control module ? run and stop on idle ye s ye s ye s ye s ? run and no stop ye s ye s ye s ye s ?stop nc ye s ye s ye s ye s ? auto-wake / auto-sleep / doze ye s ye s ye s n o data-management daemons yes yes yes pedometer applications ? step count no no yes no ?distance no no yes no ? adaptive distance no no yes no ? activity monitor no no yes no table 2. features of product-line devices (continued) feature - device mma9550l mma9551l mma9553 mma9559l
mma955xl sensors 6 freescale semiconductor, inc. 2 typical applications this low-power, intelligent sensor platform is optimized fo r use in portable and mobile consumer products such as: ? mobile phones/pmp/pda/digital cameras ? orientation detection (portrait/landscape) ? image stability ? tilt control enabled with higher resolution ? gesture recognition ? tap to control ? auto wake/sleep for low power consumption ? smartbooks/ereaders/netbooks/laptops ? anti-theft ? freefall detection for hard-disk drives ? orientation detection ? tap detection ? pedometers ? gaming and toys ? activity monitoring in medical applications ?security ? anti-theft ? shock detection ?tilt ? fleet monitoring, tracking ? dead reckoning ? system auto-wake on movement ? detection ? shock recording ? anti-theft ? power tools and small appliances ?tilt ? safety shut-off
mma955xl sensors freescale semiconductor, inc. 7 3 general description 3.1 functional overview the mma955xl device consists of a 3-axis, mems acceleromete r and a mixed-signal asic with an integrated, 32-bit cpu. the mixed-signal asic can be utilized to measure and condition the ou tputs of the mems accelerometer, internal temperature sensor, or a differential analog signal from an external device. these measured values can be read via the slave i 2 c or spi port or utilized intern ally within the mma955xl platform. figure 1. platform block diagram (1) 1. preliminary data for memory sizes. a block level view of is shown in the pr eceding figure and can be summarized at a hi gh level as an analog/mixed-mode subsystem associated with a digital engine: ? the analog sub-system is composed of: ? a 3-axis transducer that is an entirely passive block including the mems structures. ? an analog front end (afe) with the following: ? a capacitance-to-voltage converter (c to v) ? an analog-to-digital converter ? a temperature sensor ? the digital sub-system is composed of: ? the 32-bit, coldfire v1 cpu with a background-debug module (bdm) ? memory: ram, rom, and flash ? rapid gpio (rgpio) port-control logic ? timer functions include: ? modulo timer module (mtim16) ? programmable delay timer (pdb) analog front end (afe) bdm intc dbg 4 kb x 32 flash 1 kb x 32 rom 512 kb x 32 ram i 2 c master x axis c to v adc temp sensor i 2 c slave spi slave control and mailbox clkgen two-channel, 16-bit timer / pwm module 16-bit modulo timer module programmable delay block int_o y axis z axis v dd v ss reset v ss v dda v ssa rgpio scl0/rgpic0/sclk sda0/rgpio1/sdi rgpio2/scl1/sdo rgpio3/sda1/ssb rgpio4/int rgpio5/pdb_a/int_o rgpio6/an0/tpmch0 rgpio7/an1/tpmch1 rgpio8/pdb_b bkgd/ms/rpgpio9 an0 an1 tpmch0 tpmch1 scl1 scl0 pdb_a pdb_b sclk sdi sdo ssb scl0 sda0 sim bkgd int v1 coldfire core with mac
mma955xl sensors 8 freescale semiconductor, inc. ? general-purpose time r/pwm module (tpm) ?i 2 c master interface ?i 2 c or spi slave interface ? system integration module (sim) ? clock-generation module the slave interfaces (either spi or i 2 c) operate independently of the cpu subsystem. they can be accessed at any time, includ- ing while the device is in low-power, deep-sleep mode. 3.2 packaging information the package pinout definition for this device is designed as a su per set of functions found typically on freescale?s coldfire v 1 cpu offering, as well as other competit ive devices. all pins on the device are utilized and many are multiplexed. the following sections describe the pinout. users can select from multiple pin functions via the sim pin, mux-control registers . 3.2.1 package diagrams figure 2. device pinout (top view ) and package frame convention 1 2 3 4 5 678 9 13 12 11 10 16 15 14 v dd rgpio7/an1/tpmch1 rgpio8/pdb_b sda0/rgpio1/sdi bkgd-ms/rgpio9 resetb scl0/rgpio0/sclk v ss rgpio2/scl1/sdo rgpio3/sda1/ssb rgpio6/an0/tpmch0 rgpio5/pdb_a/int_o v ss rgpio4/int v dda v ssa direction of the detectable accelerations x y z 1 (top view)
mma955xl sensors freescale semiconductor, inc. 9 figure 3. package bottom view figure 4. package overlaid on pcb footprint diagram (top view) package pad size 0.24mm x 0.35 mm pin 16 pin 1 id pin 1 package size (measurements in mm) pcb land extension from the edge of the package pcb land pad pcb pad distance to package edge
mma955xl sensors 10 freescale semiconductor, inc. figure 5. recommended pcb footprint solder mask opening stencil opening 0.777 mm x 1.377 mm 0.62 mm x 0.22 mm (pcb land + 0.0637 mm (pcb land - 0.015 mm larger all around. smaller all around) remove slivers between pads.) pcb land pad size 0.65 mm x 0.25 mm
mma955xl sensors freescale semiconductor, inc. 11 3.2.2 sensing direction and output response the following figure shows the device?s default sensing direction when measuring gravity in a static manner. also included are the standard abbreviations or names for the six different orient ation modes: portrait up/down, landscape left/right and back/fr ont. figure 6. sensing direction and output response 3.2.3 pin functions the following table summarizes functional options for each pin on this device. table 3. pin functions pin # pin function #1 (1) 1. pin function #1 represents the reset state of the hardware. pin functions can be changed via the sim pin, mux-control registe rs in freescale or user firmware. pin function #2 pin function #3 description 1 v dd digital power supply 2 bkgd/ms rgpio9 background-debug / mode select / rgpio9 3 resetb (2) 2. resetb is an open-drain, bidirectional pin. reset must be pulled high at startup. after startup, reset may be asserted to res et the device. active-low reset 4 scl0 rgpio0 sclk serial clock for slave i 2 c / rgpio0 / serial clock for slave spi 5 v ss digital ground 6 sda0 rgpio1 sdi serial data for slave i 2 c / rgpio1 / spi serial data input 7r g p i o 2 s c l 1 s d o rgpio2 / serial clock for master i 2 c / spi serial data output 8 (3) 3. rgpio3/sda1/ssb = low at startup selects spi. high at startup selects i 2 c. this is a function of the application boot code, not of the hardware. rgpio3 sda1 ssb rgpio3 / serial data for master i 2 c / spi slave select 9 rgpio4 int rgpio4 / interrupt input 10 reserved (connect to v ss ) (must be grounded externally.) 11 rgpio5 pdb_a int_o rgpio5 / pdb_a / int_o slave-port interrupt output 12 rgpio6 an0 tpmch0 rgpio6 / adc input 0 / tpm channel 0 13 rgpio7 an1 tpmch1 rgpio7 / adc input 1 / tpm channel 1 14 v dda analog power 15 rgpio8 pdb_b rgpio8 / pdb_b 16 v ssa analog ground top view pu gravity pin 1 xout @ 0g yout @ -1g zout @ 0g xout @ 1g yout @ 0g zout @ 0g xout @ 0g yout @ 1g zout @ 0g xout @ -1g yout @ 0g zout @ 0g ll pd lr side view front xout @ 0g yout @ 0g zout @ 1g back xout @ 0g yout @ 0g zout @ -1g
mma955xl sensors 12 freescale semiconductor, inc. 3.3 pin function descriptions this section provides a brief description of the various pin functions available on the mma955xl platform. ten of the device pi ns are multiplexed with rapid gpio (rgpio) func tions. the ?pin function #1? column in table 3 on page 11 lists which function is active when the hardware exits the reset state. freescale or user firmware can use the pin mux-control registers in the system integration module (sim) to change pin assignments for each pin after reset. for detailed inform ation about these registers, se e the mma955xl three-axis accele rometer reference manual (mma955xlrm). v dd and v ss : digital power and ground. v dd is nominally 1.8v. v dda and v ssa : analog power and ground. v dda is nominally 1.8v. to opt imize performance, the v dda line can be filtered to remove any digital noise that can be present on the 1.8v supply. (see figure 5 and figure 6 on page 17 .) resetb: the resetb pin is an open-drain, bidirect ional pin with an internal , weak, pullup resistor. at start up, it is configured as an input pin, but also can be programmed to become bidirecti onal. using this feature, the mma 955xl device can reset external devices for any purpose other than power-on reset. reset must be pulled high at startup. after startup, reset may be asserted to reset the device. the total external capacitance to ground has to be limited when using reset b-pin, output-drive capability. for more details, see the ?system in tegration module? chapter of the mma955xl three-axis accelerometer reference manual (mma955xlrm). slave i 2 c port: sda0 and scl0: these are the slave-i 2 c data and clock signals, respectively. the mma955xl device can be controlled via the serial port or via the slave spi interface. master i 2 c: sda1 and scl1: these are the master-i 2 c clock and data signals, respectively. analog-to-digital co nversion: an0, an1: the on-chip adc can be used to perform a differential, analog-to-digital conversion based on the voltage present across pins an0(-) and an1(+). conversions for these pi ns are at the same output data rate (odr) as the mems transducer signals. inpu t levels are limited to 1.8v differential. rapid general purpose i/o: rgpio[9:0]: the coldfire v1 cpu has a feature called rapid gpio (rgpio). this is a 16-bit, input/outpu t port with single-cycle write, set, clear, and toggle f unctions available to the cpu. the mma955xl device brings ou t the lower 10 bits of that port as pins of the device. interrupts: int: this input pin can be used to wake the cpu from a dee p-sleep mode. it can be programmed to trigger on either rising or falling edge, or high or low level. this pi n operates as a level-7 (high-priority) interrupt. debug/mode control: bkgd/ms: at start up, this pin operates as mode select. if this pin is pulled high during start up, the cpu will boot normally and run code. if this pin is pulled low during start up, the cpu will boot into active background-debug mode (bdm). in bdm, this pin operates as a bi directional, single-wire, background-debug port. it can be used by development tools fo r downloading code into on-chip ram and flash and to debug that code. timer: pdb_a and pdb_b: these are the two outputs of the programmable delay block. slave spi interface: sc lk, sdi, sdo and ssb: these pins control the slave spi clock, data in, data out, and slave-select signals, respectively. the mma955xl platform can be controlled via this serial port or via the slave-i 2 c interface. sbb has a spe- cial function at startup t hat selects the slave interface mode. low at startup selects spi and high selects i 2 c. int_o: the slave-port output interrupt pin. th is pin can be used to flag the host when a response to a command is available to read on the slave port. tpmch0 and tpmch1: the i/o pin associated with 16-bit, tpm channel 0 and 1. 3.4 system connections 3.4.1 power sequencing an internal circuit powered by v dda provides the device with a power-on-reset signal. in order for this signal to be properly rec- ognized, it is important that v dd is powered up before or simultaneously with v dda . the voltage potential between v dd and v dda must not be allowed to exceed the value specified in table 7 on page 17 . 3.4.2 layout recommendations ? provide a low-impedance path from the board power supply to each power pin (v dd and v dda ) on the device and from the board ground to each ground pin (v ss and v ssa ). ? place 0.01 to 0.1-f capacitors as close as possible to th e package supply pins to meet he minimum bypass requirement. the recommended bypass configuration is to pl ace one bypass capacitor on each of the v dd /v ss pairs. v dda /v ssa . ceramic and tantalum capacitors tend to provide better tolerances. ? ensure that capacitor leads and associated printed-circuit traces that connect to the chip v dd and v ss (gnd) pins are as short as possible. ? bypass the power and ground with a capacitor of approxim ately 1 f and a number of 0.1-f ceramic capacitors.
mma955xl sensors freescale semiconductor, inc. 13 ? minimize pcb trace lengths for hi gh-frequency signals. this is es pecially critical in systems wi th higher capacitive loads tha t could create higher transient currents in the v dd and v ss circuits. ? take special care to minimi ze noise levels on the v dda and v ssa pins. ? use separate power planes for v dd and v dda and separate ground planes for v ss and v ssa . connect the separate analog and digital power and ground planes as close as possible to power supply outputs. if both analog circuit and digital circuits are powered by the same power supply, it is advisable to conn ect a small inductor or ferrite bead in series with both the v dda and v ssa traces. ? physically separate the analog components from noisy digita l components by ground planes. do not place an analog trace in parallel with digital traces. it is also desirable to plac e an analog ground trace around an analog signal trace to isolate it from digital traces. ? provide an interface to the bkgd/ms pin if in-circuit debug capability is desired. ? ensure that resistors r p1 and r p2 , in the following figure, match the requirements stated in the i 2 c standard. for the shown configuration, the value of 4.7 k would be appropriate. 3.4.3 mma955xl platform as an intelligent slave i 2 c pullup resistors, a ferrite bead, and a few bypass capacitors ar e all that are required to attach this device to a host platf orm. the basic configurations are shown in the following two figure s. in addition, the rgpio pins can be programmed to generate interrupts to a host platform in response to the occurrence of real-time application events. in this case, the pins should be r outed to the external interrupt pins of the cpu. figure 7. platform as an i 2 c slave quiet vdda for best performance 1.8v 1.8v 1.8v 1.8v 1.8v c4 1 f c3 0.1 f u1 mma955x 1 3 6 4 5 2 7 8 9 10 11 12 13 14 15 16 vdd resetb sda0/io1/sdi scl0/io0/sclk vss bkgd/ms/io9 io2/scl1/sdo io3/sda1/sbb io4/int vss io5/pdb_a/int_o io6/an0 io7/an1 vdda io8/pdb_b vssa r2 4.7k r3 4.7k l1 10 fbead 1 2 c1 1 f c2 0.1 f r1 4.7k r4 4.7k int_out i2c_clk i2c_data
mma955xl sensors 14 freescale semiconductor, inc. figure 8. platform as an spi slave quiet vdda for best performance 1.8v 1.8v 1.8v u1 mma955x 1 3 6 4 5 2 7 8 9 10 11 12 13 14 15 16 vdd resetb sda0/io1/sdi scl0/io0/sclk vss bkgd/ms/io9 io2/scl1/sdo io3/sda1/sbb io4/int vss io5/pdb_a/int_o io6/an0 io7/an1 vdda io8/pdb_b vssa c2 0.1 f c1 1 f l1 10 hbead 1 2 c4 1 f c3 0.1 f r1 4.7k r4 10k int_out spi_clk spi_di (mosi) spi_do (miso) spi_en
mma955xl sensors freescale semiconductor, inc. 15 3.4.4 mma955xl platform as a sensor hub the mma955xl device includes a powerful, 32-bit coldfire v1 cpu; a second, i 2 c bus; and one, external analog input. these features can all be monitored using the on-chip adc. the combination of low power consumption and powerful features mean that the mma955xl platfo rm can effectively operate as a power controller for handheld units such as cell phones, pdas, a nd games. the host platform can put itself to sleep with con- fidence that the mma955xl device will issue a wake request should any external event require its attention. the following figure illustrates the mma955xl device being used in this configuration. observe how all that is required is a fe w bypass capacitors, a ferrite bead, and some pullup resistors for the i 2 c buses. figure 9. platform as sensor hub quiet vdda for best performance i2c digital sensors differential analog sensor 1.8v 1.8v 1.8v 1. 8v 1.8v c4 1 f r1 4.7k c1 1 f u1 mma955x 1 3 6 4 5 2 7 8 9 10 11 12 13 14 15 16 vdd resetb sda0/io1/sdi scl0/io0/sclk vss bkgd/ms/io9 io2/scl1/sdo io3/sda1/sbb io4/int vss io5/pdb_a/int_o io6/an0 io7/an1 vdda io8/pdb_b vssa l1 10 fbead 1 2 c3 0.1 f r2 4.7k r3 4.7k c2 0.1 f r3 4.7k r4 4.7k i2c_data i2c_clk int_out i2c_clk i 2c_data int_in resetb
mma955xl sensors 16 freescale semiconductor, inc. 4 mechanical and electrical specifications this section contains electrical specif ication tables and reference timing diagrams for the mma955xl device, including detailed information on power considerations, dc/ac electrical characteristics, and ac timing specifications. 4.1 definitions cross-axis sensitivity the proportionality co nstant that relates a variation of accele rometer output to cross acceleration. this sensitivity varies with the dire ction of cross acceleration and is primarily due to misalignment. full range the algebraic difference between the upper and lo wer values of the input range. refer to the input/ output characteristics. hardware compensated sensor modules on this device include hard ware-correction factors for gain and offset errors that are calibrated during factory test using a least-squares fit of the raw sensor data. linearity error the deviation of th e sensor output from a least-squares linear fit of the input/output data. nonlinearity the systematic deviation from the straight line that defines the nominal input/output relationship. pin group the clustering of device pins into a number of logical pin groupings to simplify and standardize electrical data sheet parameters. pin groups are defined in section 4.2, ?pin groups? . software compensated freescale?s advanced non-linear calibratio n functions that?with the first-order hardware gain and off- set calibration features?improve sensor performance. warm-up time the time from the initial application of powe r for a sensor to reach its specified performance under the documented operating conditions. 4.2 pin groups the following pin groups are used throughout the remainder of this section. group 1 resetb group 2 reserved group 3 rgpio[9:0] 4.3 absolute maximum ratings absolute maximum ratings are stress ratings only and operation at these maximums is not guaranteed. stress beyond the limits specified can affect device reliability or cause permanent damage to the device. for f unctional operating conditions, refer to the remaining tables in this section. this device contains circuitry to protect against damage due to high static voltage or electrical fields. it is advised, howeve r, that normal precautions be taken to avoid application of any voltages hig her than maximum-rated voltages to this high-impedance circuit. reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for instance, ei ther v ss or v dd ). table 4. absolute maximum ratings rating symbol minimum maximum unit digital supply voltage v dd -0.3 2.0 v analog supply voltage v dda -0.3 2.0 v voltage difference, v dd to v dda v dd - v dda -0.1 0.1 v voltage difference, v ss to v ssa v ss - v ssa -0.1 0.1 v input voltage v in -0.3 v dd + 0.3 v input/output pin-clamp current i c -20 20 ma output voltage range (open-drain mode) v outod -0.3 v dd + 0.3 v storage temperature t stg -40 125 c mechanical shock sh 5k g
mma955xl sensors freescale semiconductor, inc. 17 4.4 operating conditions 4.5 electrostatic discharge (esd) a nd latch-up protection characteristics 4.6 general dc characteristics table 5. nominal operating conditions rating symbol condition(s) min typ max unit digital supply voltage v dd 1.71 1.8 1.89 v analog supply voltage v dda 1.71 1.8 1.89 v voltage difference, v dd to v dda v dd - v dda -0.1 0.1 v voltage difference, v ss to v ssa v ss - v ssa -0.1 0.1 v input voltage high v ih 0.7*v dd v dd +0.1 v input voltage low v il v ss - 0.3 0.3*v dd v operating temperature t a -40 25 85 c table 6. esd and latch-up protection characteristics rating symbol min max unit human body model (hbm) v hbm 2000 ? v machine model (mm) v mm 200 ? v charge device model (cdm) v cdm 500 ? v latch-up current at 85c i lat 100 ? ma table 7. dc characteristics (1) 1.all conditions at nominal supply: v dd = v dda = 1.8v. characteristic symbol condition(s) (2) 2.pin groups are defined in ?pin groups? on page 16 . min typ max unit output voltage high ? low-drive strength ? high-drive strength v oh pin groups 1 and 3 i load = -2 ma i load = -3 ma vdd - 0.5 ? ? v output voltage low ? low-drive strength ? high-drive strength v ol pin groups 1 and 3 i load = 2 ma i load = 3 ma ??0.5v output-low current max total i ol for all ports i olt 24 ma output-high current max total i oh for all ports i oht 24 ma input-leakage current |i in | pin group 2 v in = v dd or v ss ?0.1 1 a hi-z (off-state) leakage current |i oz | pin group 3 input resistors disabled v in = v dd or v ss ?0.1 1 a pullup resistor r pu when enabled 17.5 52.5 k power-on-reset voltage v por 1.50 v power-on-reset hysteresis v por-hys 100 mv input-pin capacitance c in 7p f output-pin capacitance c out 7p f
mma955xl sensors 18 freescale semiconductor, inc. 4.7 supply current characteristics 4.8 accelerometer transducer mechanical characteristics table 8. supply current characteristics (1) 1. all conditions at nominal supply: v dd = v dda = 1.8v. characteristic symbol condition(s) min typ max unit supply current in stop nc mode i dd-snc internal clocks disabled 2 a supply current in stop sc mode i dd-ssc internal clock in slow-speed mode 15 a supply current in run mode (2) 2. total current with the analog section active, 16 bits adc reso lution selected, mac unit used and all peripheral clocks enable d. i dd-r internal clock in fast mode 3.1 ma table 9. accelerometer characteristics characteristic symbol condition(s) min typ max unit full range a fr 2g 1.8 2 2.2 g 4g 3.6 4 4.4 8g 7.2 8 8.8 sensitivity/resolution a sens 2g 0.061 mg/lsb 4g 0.122 8g 0.244 zero-g level offset accuracy (pre-board mount) off pbm 2g -100 +100 mg 4g 8g non-linearity best fit straight line a nl 2g 0.25 % a fr 4g 0.5 8g 1 sensitivity change vs.temperature tc sa 2g 0.17 %/c zero-g level change vs. temperature (1) 1. relative to 25c. tc off 1.9 mg/c zero-g level offset accuracy (post-board mount) off bm 2g -100 +100 mg 4g 8g output data bandwidth bw odr/2 hz output noise noise 2g, odr = 488 hz 100 g/sqrt(hz) 8g, odr = 488 hz 120 g/sqrt(hz) cross-axis sensitivity -5 5 %
mma955xl sensors freescale semiconductor, inc. 19 4.9 temperature sensor characteristics 4.10 adc characteristics 4.11 adc sample rates the mma955xl platform supports the following sample rates: ? 488.28 frames per second (fps) ? 244.17 fps ? 122.07 fps ? 61.04 fps ? 30.52 fps ? 15.26 fps ?7.63 fps ?3.81 fps table 10. temperature sensor characteristics (1) 1. all conditions at nominal supply: v dd = v dda = 1.8v. characteristic symbol condition(s) min typ max unit full range t fr -40 85 c sensitivity t sens 0.00252 c/lsb non-linearity t nl 1 c table 11. adc characteristics (1) 1. all conditions at nominal supply: v dd = v dda = 1.8v and r es = 14, unless otherwise noted. characteristic symbol condition(s) min typ max unit input voltage v ai voltage at an0 or an1 0.2 1.1 v differential input voltage v adi an1 - an0 -0.9 0.9 v full-scale range v fs 1.8 v programmable resolution r es 10 14 16 bits conversion time @ 14-bits resolution (three-sample frame) t c 207 s integral non-linearity inl full scale 15 lsb differential non-linearity dnl 2 lsb input leakage i ia 2 a effective number of bits enob 13.5 bits
mma955xl sensors 20 freescale semiconductor, inc. 4.12 ac electrical characteristics tests are conducted using the input levels specified in table 5 on page 17 . unless otherwise specified, propagation delays are measured from the 50-percent to 50-percent point. rise a nd fall times are measured between the 10-percent and 90-percent points, as shown in the following figure. figure 10. input signal measurement references the subsequent figure shows the definit ions of the following signal states: ? active state, when a bus or signal is driven and enters a low-impedance state ? three-stated, when a bus or signal is placed in a high-impedance state ? data valid state, when a signal level has reached v ol or v oh ? data invalid state, when a signal level is in transition between v ol and v oh figure 11. signal states 4.13 general timing control table 12. general timing characteristics (1) 1. all conditions at nominal supply: v dd = v dda = 1.8 v characteristic symbol condition(s) min typ max unit v dd rise time t rvdd 10% to 90% 1 ms por release delay (2) 2. this is the time measured from v dd = v por until the internal reset signal is released. t por power-up 0.35 1.5 ms warm-up time t wu from stop nc 7 sample periods frequency of operation f oph full speed clock 8 mhz f opl slow clock 62.5 khz system clock period t cych full speed clock 125 ns t cycl slow clock 16 s full/slow clock ratio 128 oscillator frequency absolute accuracy @ 25c full speed clock -5 +5 % oscillator frequency variation over temperature (-40c to 85c vs. ambient) slow clock -6 +6 % minimum reset assertion duration t ra 4t (3) 3. in the formulas, t = 1 system clock cycle. in full speed mode, t is nominally 125 ns. in slow speed mode, t is nominally 16 s. v ih v il fall time input signal note: the midpoint is v il + (v ih ? v il )/2. midpoint1 low high 90% 50% 10% rise time data invalid state data1 data 3-stated data3 valid data2 data3 data1 valid data active data active data1 valid
mma955xl sensors freescale semiconductor, inc. 21 4.14 i 2 c timing this device includes a slave i 2 c module that can be used to control the sensor and can be active 100 percent of the time. it also includes a master/slave i 2 c module that should be used only during cpu run mode ( d ). figure 12. i 2 c standard and fast-mode timing 4.14.1 slave i 2 c 4.14.2 master i 2 c timing the master i 2 c module should only be used when the system clock is running at full rate. do not at tempt to use the master i 2 c module across frames in which a portion of the time is spent in low-speed mode. table 13. i 2 c speed ranges mode max baud rate (f scl ) minimum bit time minimum scl low (t low ) minimum scl high (t high ) min data setup time (t su; dat ) min/max data hold time (t hd; dat ) standard 100 khz 10 s4 . 7 s4 s 250 ns 0 s/3.45 s (1) 1. the maximum t hd; dat must be at least a transmission time less than t vd;dat or t vd;ack . for details, see the i 2 c standard. fast 400 khz 2.5 s1.3 s0 . 6 s 100 ns 0 s/0.9 s (1) fast + 1 mhz 1 s 500 ns 260 ns 50 ns 0 s/0.45 s (1) high-speed supported 2.0 mhz 0.5 s 200 ns 200 ns 10 ns (2) 0 ns/70 ns (100 pf) (2) 2. timing met with ife = 0, ds = 1, and se = 1. see the ?port controls? chapter in the mma955xl three-axis accelerometer reference manual (mma955xlrm). table 14. master i 2 c timing characteristic symbol standard mode fast mode unit min max min max scl clock frequency f scl 0 100 0 400 khz hold time (repeated) start conditi on. after this period, the first clock pulse is generated. t hd; sta 4.0 ? 0.6 ? s low period of the scl clock t low 4.7 ? 1.3 ? s high period of the scl clock t high 4.0 ? 0.6 ? s setup time for a repeated start condition t su; sta 4.7 ? 0.6 ? s data hold time for i 2 c-bus devices t hd; dat 0 (1) 1. the master mode i 2 c deasserts ack of an address byte simultaneously with the falling edge of scl. if no slaves acknowledge this address byte, a n eg- ative hold time can result, depending on the edge rates of the sda and scl lines. 3.45 (2) 2. the maximum t hd; dat must be met only if the device does not stretch the low period (t low ) of the scl signal. 0 (1) 0.9 (2) s data setup time t su; dat 250 (3) 3. setup time in slave-transmitter mode is one ipbus clock period, if the tx fifo is empty. ? 100 (3) (4) 4. a fast-mode i 2 c bus device can be used in a standard mode i 2 c bus system, but the requirement t su; dat 250 ns must then be met. this will automat- ically be the case if the device does not stretch the low period of the scl signal. if such a device does stretch the low period of the scl signal, it must output the next data bit to the sda line tr max + t su; dat = 1000 + 250 = 1250 ns (according to the standard-mode i 2 c bus specification) before the scl line is released. ?ns setup time for stop condition t su; sto 4.0 ? 0.6 ? s bus-free time between stop and start condition t buf 4.7 ? 1.3 ? s pulse width of spikes that must be suppressed by the input filter t sp n/a n/a 0 50 ns sda scl t hd; sta t hd; dat t low t su; dat t high t su; sta sr p s s t hd; sta t sp t su; sto t buf t f t r t f t r
mma955xl sensors 22 freescale semiconductor, inc. 4.15 slave spi timing the following table describes the timing requirements for the spi system. t he ?#? column refers to the numbered time period in figure 13 . figure 13. spi slave timing table 15. slave spi timing # function symbol min max unit ? operating frequency f op 0f oph /4 hz 1 sclk period t sclk 4?t cych 2 enable lead time t lead 0.5 ? t cych 3 enable lag time t lag 0.5 ? t cych 4 clock (sclk) high or low time t wsclk 200 ? ns 5 data setup time (inputs) t su 15 ? ns 6 data-hold time (inputs) t hi 25 ? ns 7 access time t a ?2 5n s 8 sdo-disable time t dis ?2 5n s 9 data valid (after sclk edge) t v ?2 5n s 10 data-hold time (outputs) t ho 0?n s 11 rise time input output t ri t ro ? ? 25 25 ns ns 12 fall time input output t fi t fo ? ? 25 25 ns ns sclk (input) sdi (input) sdo (output) ss (input) msb in bit 6 . . . 1 lsb in msb out slave lsb out bit 6 . . . 1 note: slave see note 1. not defined but normally msb of character just received. 12 1 < 11 3 4 24 7 5 6 9 8 10 10
mma955xl sensors freescale semiconductor, inc. 23 4.16 flash parameters the mma955xl platform has 16 kb of internal flash memory. ther e are rom functions that allow erase and programming of that memory. chip supply voltage of 1.8v is sufficient for the flash programming voltage. the size of the available flash memory varies between the diff erent devices in the mma955xl pr oduct family, as shown in the following figure. the smallest block of memory that can be written is 4 bytes and those 4 bytes must be aligned on a 4-byte boundary. the largest block of memory that can be programmed is 128 by tes and the block must start at a 128-byte boundary. flash programming blocks must start on a 4-byte boundary and cannot cross a 128-byte page boundary. 5 package information the mma955xl platform uses a 16-lead lga package, case number 2094. use the following link for the latest diagram of the package: http://www.freescale.com/files/shared /doc/package_info/98asa00287d.pdf figure 14. flash memory map for devices table 16. flash parameters parameter value word depth 4096 row size 128 bytes page erase size (erase block size) 4 rows = 512 bytes maximum page programming size 1 row = 128 bytes minimum word programming size 4 bytes memory organization 4096 x 32 bits = 16 kb total endurance 20,000 cycles minimum data retention > 100 years, at room temperature 9.5 kb user firmware gesture firmware pedometer firmware factory firmware base firmware foundation firmware 11.5 kb 14.5 kb (1 ) 2 kb 1. estimated value. mma 9550l mma9551l mma9553l mma9559l motion-sensing gesture-sensin g pedometer high-flexibility platform platform platform platform
mma955xl sensors 24 freescale semiconductor, inc. 6 revision history revision number revision date description of changes 0 06/2011 initial release of document. 1 10/2011 ? removed mma9552l device from produc t family and added the mma9559l device. ? added a features table and a package land diagram figure. ? modified block diagram ? inserted flash memory map figure
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